Wafer and Substrate Bumping Pastes Kester has leveraged decades of experience in solder paste product development in engineering an extensive selection of wafer and substrate bumping pastes. Bumping of wafers and substrates with solder paste is a growing technology that is low-cost with high yields and competitive quality. Kester's array of bumping pastes supports flexible, high volumn applications. Contact Kester for assistance in finding an optimized solution. |
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| Flux Type | No-Clean | Water-Soluble | |
| Fomular | Se-Cure® 7501 | Se-Cure® 7601 | Se-Cure® 7101 |
| Application | Organic In-Situ Stencils | Metal Foils and Organic In-Situ Stencils | Metal Foil Stencil |
| Product Characteristic | Se-Cure® 7501 is specifically designd for organic in-situ wafer bumping applications. The printing performance of 7501 has been engineered to be best in class and prints easily on wafers of bump pitches down to 135µm (bump heights of 70µm). Its voiding occurrence rate is consistently below 10% thershold. Se-cure® 7501 bumping paste is available in Sn63Pb37 and also low alpha and ultra-low alpha emitting Sn63Pb37. | Designed for substrate, wafer-bumping and ultra-low pitch printing operations. Se-Cure® 7601 thermally stable fluxing system is compatible with both eutectic SnPb and lead-free (SnCu, SnAg, and SnAgcu) alloys. This high activity paste exhibits long stencil life while still delivering exceptional solderability and low voiding. | Designed for wafer bumping and ultra-low pitch bumping applications, Se-Cure® 7101 is a thermally stable flux system that reduces voiding in FC and CSP. When using Se-Cure® 7101, the voiding level of FC and CSP's has been reduced from 25% to less than 10%. It releases cleanly from stencil apertures up to area ratio of 1.5 (mesh size dependant) without slumping or flux bleed out and with optimal deposit definition. The activator package has been formulated to exhibit exceptional wetting characteristics to many different Under Bump Metallurgies (UBM) and is available in Sn63Pb37, lead-free alloys, low alpha, and ultra-low alpha solder alloys. |
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